Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices.

Silicon-based microchannel technology offers unmatched performance in the cooling of silicon pixel detectors in high-energy physics. Although Si-Si direct bonding, used for the fabrication of cooling plates, also meets the stringent requirements of this application (its high-pressure resistance of ~200 bar, in particular), its use is reported to be a challenging and expensive process. In this study, we evaluated two alternative bonding methods, aiming toward a more cost-effective fabrication process: Si-Glass-Si anodic bonding (AB) with a thin-film glass, and Au-Au thermocompression (TC). The bonding strengths of the two methods were evaluated with destructive pressure burst tests (0-690 bar) on test structures, each made of a 1 × 2 cm2 silicon die etched with a tank and an inlet channel and sealed with a plain silicon die using either the AB or TC bonding. The pressure resistance of the structures was measured to be higher for the TC-sealed samples (max. 690 bar) than for the AB samples (max. 530 bar), but less homogeneous. The failure analysis indicated that the AB structure resistance was limited by the adhesion force of the deposited layers. Nevertheless, both the TC and AB methods provided sufficient bond quality to hold the high pressure required for application in high-energy physics pixel detector cooling.

Single-Step-Lithography Micro-Stepper Based on Frictional Contact and Chiral Metamaterial.

Stepper motors and actuators are among the main constituents of control motion devices. They are complex multibody systems with rather large overall volume due to their multifunctional parts and elaborate technological assembly processes. Miniaturization of individual parts is still posing assembly problems. In this paper, a single-step lithography process to fabricate a micro-stepper engine with an accurate micrometric rotation axis and an overall sub-millimeter size is demonstrated. The device is based on the frictional contacts and chiral metamaterials to get rid of the dependence on the accuracy of parts. The functional aspects of fabricated samples are discussed for many rotation cycles and for different frictional surfaces.

Biosorbents from Plant Fibers of Hemp and Flax for Metal Removal: Comparison of Their Biosorption Properties.

Lignocellulosic fibers extracted from plants are considered an interesting raw material for environmentally friendly products with multiple applications. This work investigated the feasibility of using hemp- and flax-based materials in the form of felts as biosorbents for the removal of metals present in aqueous solutions. Biosorption of Al, Cd, Co, Cu, Mn, Ni and Zn from a single solution by the two lignocellulosic-based felts was examined using a batch mode. The parameters studied were initial metal concentration, adsorbent dosage, contact time, and pH. In controlled conditions, the results showed that: (i) the flax-based felt had higher biosorption capacities with respect to the metals studied than the hemp-based felt; (ii) the highest removal efficiency was always obtained for Cu ions, and the following order of Cu > Cd > Zn > Ni > Co > Al > Mn was found for both examined biosorbents; (iii) the process was rapid and 10 min were sufficient to attain the equilibrium; (iv) the efficiency improved with the increase of the adsorbent dosage; and (v) the biosorption capacities were independent of pH between 4 and 6. Based on the obtained results, it can be considered that plant-based felts are new, efficient materials for metal removal.